Surface Metals: KOBE's patented process can reclaim all types of used wafers and provides several barriers to cross contamination from metal wafers. Surface metal data is monitored daily by using VPD/ICPMS with an outside independent laboratory. Our process capabilities have satisfied the most demanding global IC makers.

Silicon Thickness Removal for Any Type of Wafer: We
tend to receive the most difficult used wafers from major companies that have already recycled the wafers through many internal steps before sending them out for external reclaim. Our process is designed to minimize the amount of silicon removed through the reclaiming. Some of the limits for minimal removal are the depth of Epi layers, trenches, pre-existing scratches and handling defects.

Total Thickness Variation (TTV): Our fully automated waxmount and polishing lines achieve average TTV of <3.0 microns for 200mm wafers.

Global Flatness (GTIR): Average GTIR recorded on 200mm is < 2.0 microns, exceeding current reclaim standards.

Light Point Defects(LPD): At KOBE, we utilize Tencor SP-1 and 6220 models for inspection of final polished surface quality. Process improvements have, on average, reduced the total number of LPD's per wafer. This level is similar to many prime wafer suppliers and has propelled KOBE to the top tier of the reclaim industry. Data is regularly monitored down to 0.13 micron size.

Quality: We continue to strive on our quality performing 100% visual inspection in critical areas. To ensure traceability, KOBE monitors wafer movement through a detailed tracking system. In addition, custom laser scribes are routinely applied to segregate specific customer products. In 1997 we became ISO 9002 certified.