April 2001
KPI expands 300mm capacity

HAYWARD, Calif., April 1, 2001

Kazuo Ogata president of KPI announced 300mm expansion:

To keep up with increasing demands, and to maintain a leadership position in silicon wafer reclaim and polishing services in Northern America, we have expanded our 300mm capacity.

Anticipating a rapid conversion to 300mm, by equipment suppliers and device makers, we commissioned a 300mm pilot line, in the second half of 2000. As demand rose in the fourth quarter, we converted some of our existing 200mm tools, as well as purchased new tool sets, in preparation of increased future demands.

We are happy to report that, due to the recent activities, our capacity for 300mm services has been increased three-fold. In any conversion and/or expansion, maintaining the highest level of quality is of the utmost importance. We have continued to provide our business partners with “uninterrupted” performance at all quality levels. As always, our light point defects (LPD’s) remain at levels similar to prime wafers suppliers. That same performance in providing high quality 200mm services has propelled KOBE to the top tier of the reclaim industry.

As more device makers convert to 300mm manufacturing, due to the tremendous costs advantages, we welcome the challenge to successfully meet their growing demands for high quality, cost saving, 300mm reclaim services.

About KPI
With its patented silicon wafer reclaim process, Kobe Precision, Inc. is a leader in silicon wafer reclaim and polishing services, providing its customers with unparalleled quality and value by removing minimal silicon, from it’s original state. In addition to these services, the company also offers finished test wafers to its customers. KPI works with a range of customer types and sizes including equipment companies and semiconductor manufacturers supporting them with 200 mm(8 in.) and 300 mm (12 in.) wafer sizes.