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KOBE Precision, Inc. (KPI) was established
as a subsidiary of Kobe Steel,
Ltd., in November of 1987 with the primary purpose of manufacturing
and selling aluminum ground substrates for computer memory disks
in the United States. During the twelve years of its disk operation,
from October 1988 through January 2000, KPI became the number one
worldwide supplier of aluminum ground substrates. KPI closed its
disk operation in January 2000 due to declining pricing trend of
disks and a decreased demand for aluminum substrates in the U.S.
market.
In 1993, KPI decided to venture into the semiconductor
industry by providing wafer reclaim and polishing services to semiconductor
companies. KPI began researching the market by asking major semiconductor
companies what they liked and disliked about the existing wafer
reclaim services. After this marketing phase, we set out to create
a new reclaim process that would advance the basic techniques that
had been in place since the industry started in the 1970.
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AUTOMATED WAFER POLISHING: A fully automated polishing
line provides the technology and capability to produce wafers
demanding some of the most stringent requirements. These polishers
are capable of monitoring pad temperature, pad life and slurry
flow to maintain consistent quality throughout processing cycle.
Integrated wafer de-mounting offers additional automation to
reduce the amount of operator handling..
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After two years of research and development,
and a lengthy qualification with a major global semiconductor company,
the new Precision Reclaim Process was ready for volume production.
In April 1996, volume production of commercial reclamation silicon
wafers began. We quickly added capacity in three expansion phases
while maintaining a reputation for world class quality and highly
responsive service supporting the most prominent players in the
semiconductor industry
We remove all of the non-silicon materials from
the wafer surface and then recondition the wafer to "super
clean" standards. The patented Precision Reclaim Process
has been offering the lowest cost of ownership to customers with
consistent minimal removal for any type of used wafer. As the semiconductor
business migrates toward larger silicon wafers, the economic need
to reclaim both used test wafers and failed product wafers escalates.
Reclaiming fills this demand by "recycling" wafers and
returning them to the original customer for use in test wafer applications.
This unique process is of great value to the customers as they enjoy
more reclaim cycles per wafer, consistent product quality and unparalleled
service.
KPI also offers finished reclaimed and virgin
test wafers for sale. This is different from the reclaim service
in that the customer does not need to send in wafers for reclaim.
KPI's total quality control (Kaizen) is based
on its conviction that continued growth will be possible only through
continuous quality improvement and ever increasing productivity.
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AUTOMATED WAFER CLEANING: All wafers are processed through
a fully automated, multi-bath cleaning tool, designed to support
150mm, 200mm and 300mm diameter wafers. Chemical preparation,
replenishment and integrated drying, provide state-of-the-art
cleaning with high capacity through-put.
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